Important Deadlines

  • Submission of an abstract:
  • 30th November 2018
  • Notification of acceptance:
  • 15th January 2019
  • Submission of the 4-page paper:
  • 29th February 2019



The objectives of the Congress are to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the world who are involved in the field of thermal stresses to exchange ideas and to extend further cooperation among participants. The Congress should forge cooperative links between researches and engineers by bringing them to one place where they present their achievements and conduct discussions.



This is a conference on thermal stresses and related topics, with particular focus on the following, but not limited to them: 

uThermal Stresses and Deformations 

uThermoelasticity and Viscoelasticity

uThermal Stresses in

uContact Mechanics

uDynamic Problems

uFracture and Fatigue of Heterogeneous Materials and Manufacturing



uThermal Shock

uContinuum Thermomechanics

uHeat Conduction, Convection and Radiation Problems

uExperimental Methods in Thermomechanics

uComputational Methods in Thermomechanics

uControl of Thermal Structures

uInstability and Localization under Thermomechanic Loading

uInverse and Optimization Methods in Thermomechanics

uThermal Stresses in Smart Materials

uThermal-Induced Fracture of Smart Materials 


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